Ultrahigh vacuum packaging and surface cleaning for quantum devices

We describe design, implementation and performance of an ultra-high vacuum (UHV) package for superconducting qubit chips or other surface sensitive quantum devices. The UHV loading procedure allows annealing, ultra-violet light irradiation, ion milling passivation devices before sealing them into a measurement package. retains during the transfer to cryogenic temperatures by active pumping with titanium getter layer. characterize treatment capabilities system present measurements flux tunable qubits average T$_1=84~\mu$s T$^{echo}_2=134~\mu$s after vacuum-loading these samples bottom dilution refrigerator in UHV-package.